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Chip-Packaging-Substrate Jobs

Explore 1 active Chip-Packaging-Substrate job openings aggregated from hundreds of sources. Roles range from entry-level to executive, remote and on-site, refreshed hourly.

1 job · newest first

  1. Leader/Manager Endfertigung and Lapping Laboratory 100%

    Dyconex AG Schweiz, Kanton Zürich, Bülach, Nürensdorf CH

    Leader/Manager Endfertigung and Lapping Laboratory 100% (w/m/d)Quality, Miniaturization and highest Reliability – that's what the DYCONEX AG, a member of the SOMACIS Group, stands for. As a worldwide...

    7 months ago
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