Swissbit
1 week ago
Semiconductor Packaging Engineer / Process Engineer Advanced Packaging (m/f/d)
Sign up to save this job, get alerts, and apply with an optimized CV.
Company information
- Company
- Swissbit
- Location
- DE-Berlin Germany
- Posted
- 1 week ago
Job description
A Swissbit more you.
With us, you shape the future! Swissbit is the leading European manufacturer of memory and security solutions for industrial and IoT applications. We strengthen the digital and connected world by reliably storing and protecting data. For these and many other exciting projects, we are looking for colleagues who want to make a difference with us. Together, we are driving forward the technological innovations of tomorrow – with passion, courage, and the ambition to always be one step ahead.
Your Mission
In this role, you will be responsible for the development and optimization of technologies and processes in Advanced Semiconductor Packaging. The focus is on supporting external customer projects as well as internal development projects – from technical solution finding to implementation with Process Engineering, Quality Management, and Sales.
Exciting Tasks Await You
- Development, optimization, and industrialization of technology processes in Advanced Semiconductor Packaging
- Technical support and management of external customer projects with a focus on component manufacturing, System in Package, and Chiplet technologies
- Coordination of internal development projects, including technical alignment, progress tracking, and internal/external reporting
- Close professional collaboration with Process Engineering, Quality Management, and Sales to develop customer-specific solutions
- Ensuring quality standards, project goals, and robust decision-making bases through analyses and process evaluations
Your Profile
- Completed engineering degree, e.g., in Microsystems Engineering, Electrical Engineering, Process Engineering, Mechanical Engineering, Production Engineering, or comparable qualification
- Several years of experience in the development, optimization, and management of technology processes as well as in the support of technical customer projects
- Knowledge in assembly and interconnection technologies, e.g., soldering, Chip on Board, dicing, wafer processing, or molding
- Ideally, know-how in Advanced Packaging, System in Package, Chiplet, or substrate technologies
- Confident use of process control, process optimization, analyses, and technical decision-making bases
- Fluent German and good English skills
What We Offer You
- Thorough onboarding into a motivated team with a pleasant working atmosphere & open communication culture
- Ideal walking distance connection via BVG, S7 Raoul-Wallenberg-Str. / S75 Gehrenseestr. / Bus 154, as well as parking directly on the company premises
- Flexible working hours and annual working time account
- Family-friendly corporate culture
- Personal and professional development and further training opportunities
- We don't even mention the excellent coffee, foosball, table tennis, or the grill on the roof terrace, because we are focused on substance: the exciting environment at an innovative medium-sized company with high technical diversity
Find more English Speaking Jobs in Germany on Arbeitnow
Required skills
- sales
- teamwork
- english
- german
- mechanical engineering
- public transportation
- quality standards
- process optimization
- reporting
- further training
- molding
- process engineering
- quality management
- parking
- professional development
- onboarding
- flexible working hours
- electrical engineering
- soldering
- innovative
- security solutions
- engineering degree
- process control
- analyses
- customer projects
- process development
- process engineer
- production engineering
- industrialization
- industrial applications
- iot applications
- family-friendly
- project goals
- medium-sized company
- progress tracking
- customer-specific solutions
- working atmosphere
- decision-making bases
- component manufacturing
- chip on board
- technical alignment
- semiconductor packaging
- annual working time account
- process evaluations
- communication culture
- memory solutions
- advanced packaging
- technical diversity
- wafer processing
- dicing
- technology processes
- interconnection technologies
- system in package
- substrate technologies
- internal development projects
- technical solution finding
- chiplet technologies
- microsystems engineering
- assembly technologies
Interested in this position?
Create your free account and tailor your CV to match this job.