Semiconductor Packaging Engineer / Process Engineer Advanced Packaging (m/f/d)

With us, you shape the future! Swissbit is the leading European manufacturer of storage and security solutions for industrial and IoT applications. We strengthen the digital and connected world by reliably storing and protecting data. For these and many other exciting projects, we are looking for colleagues who want to make a difference with us. Together, we drive forward the technological innovations of tomorrow – with passion, courage, and the ambition to always be one step ahead.

In this role, you will be responsible for the development and optimization of technologies and processes in Advanced Semiconductor Packaging. The focus is on supporting external customer projects as well as internal development projects – from finding technical solutions to implementation with Process Engineering, Quality Management, and Sales.

• Development, optimization, and industrialization of technology processes in Advanced Semiconductor Packaging
• Technical support and management of external customer projects with a focus on component manufacturing, System in Package, and Chiplet technologies
• Coordination of internal development projects, including technical alignment, progress tracking, and internal/external reporting
• Close technical collaboration with Process Engineering, Quality Management, and Sales to develop customer-specific solutions
• Ensuring quality standards, project goals, and robust decision-making foundations through analyses and process evaluations

• Completed engineering degree, e.g., in Microsystems Technology, Electrical Engineering, Process Engineering, Mechanical Engineering, Production Engineering, or comparable qualification
• Several years of experience in the development, optimization, and management of technology processes as well as in supporting technical customer projects
• Knowledge in assembly and interconnection technologies, e.g., soldering, Chip on Board, dicing, wafer processing, or molding
• Ideally, know-how in Advanced Packaging, System in Package, Chiplet, or substrate technologies
• Proficient in process control, process optimization, analyses, and technical decision-making foundations
• Fluent German and good English skills

• Thorough onboarding into a motivated team with a pleasant working atmosphere & open communication culture
• Ideal walking distance access via BVG, S7 Raoul-Wallenberg-Str. / S75 Gehrenseestr. / Bus 154, as well as parking directly on the company premises
• Flexible working hours and an annual working time account
• Family-friendly corporate culture
• Personal and professional development and further training opportunities
• We don't even list the very good coffee, foosball, table tennis, or the grill on the roof terrace, because for us it's about substance: the exciting environment at an innovative medium-sized company with high technical diversity

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