R&D Process Engineer (Etch Packaging)

Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to push the boundaries of technology and create a better future, join us! Our Team The Packaging R&D team is responsible for developing advanced packaging processes for the next generation of semiconductors. We are seeking a highly motivated and experienced R&D Process Engineer to join our team. Responsibilities * Develop, optimize, and characterize etch processes for advanced packaging applications. * Work with cross-functional teams, including equipment engineering, applications, and manufacturing, to transfer processes to high-volume manufacturing. * Design and execute experiments to improve process performance, yield, and reliability. * Analyze data using statistical methods and present findings to the team. * Troubleshoot process issues and implement corrective actions. * Stay current with the latest packaging technologies and trends. Qualifications * Bachelor's or Master's degree in Chemical Engineering, Materials Science, or a related field. * 3+ years of experience in semiconductor process engineering, with a focus on etch processes. * Strong understanding of etch process fundamentals, including plasma physics, chemistry, and materials science. * Experience with a variety of etch equipment, such as ICP and RIE systems. * Experience with a variety of packaging materials, such as dielectrics, metals, and polymers. * Experience with statistical process control (SPC) and design of experiments (DOE). * Excellent communication, teamwork, and problem-solving skills. * Ability to work independently and as part of a team. * Ability to travel occasionally. Preferred Qualifications * PhD in Chemical Engineering, Materials Science, or a related field. * Experience with advanced packaging technologies, such as fan-out wafer-level packaging (FOWLP) and through-silicon vias (TSVs). * Experience with metrology and characterization techniques. * Experience with process modeling and simulation. Benefits At Applied Materials, we are committed to providing our employees with a comprehensive and competitive benefits package. Here are some of the benefits we offer: * Competitive salary * Health insurance (medical, dental, and vision) * Paid time off * 401(k) plan with company match * Stock options * Employee stock purchase plan * Life insurance * Disability insurance * Flexible spending accounts * Employee assistance program * Professional development opportunities * Tuition reimbursement * On-site gym and fitness classes * And more! Applied Materials is an Equal Opportunity Employer. We are committed to a diverse and inclusive workforce. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.