Swissbit
5 hours ago
Process Development Engineer – Semiconductor Packaging (m/f/d)
Sign up to save this job, get alerts, and apply with an optimized CV.
Company information
- Company
- Swissbit
- Location
- DE-Berlin Germany
- Posted
- 5 hours ago
Job description
With us, you shape the future! Swissbit is the leading European manufacturer of storage and security solutions for industrial and IoT applications. We strengthen the digital and connected world by reliably storing and protecting data. For these and many other exciting projects, we are looking for colleagues who want to make a difference with us. Together, we drive forward the technological innovations of tomorrow – with passion, courage, and the ambition to always be one step ahead.
Your Mission
As a Process Technology Engineer (m/f/d), you will develop new process technologies for advanced packaging manufacturing in our R&D department. You will accompany development projects, work closely with internal interfaces, and contribute to the stable, efficient, and quality-oriented implementation of innovative manufacturing processes.
Exciting tasks await you
- Development of new technology processes in Semiconductor Packaging, especially for wafer, substrate, and panel processing
- Selection of suppliers for new process equipment and project support, including reporting
- Definition of process limits and design rules within the framework of ADKs as well as support for new product and process projects
- Close cooperation with Process/Industrial Engineering, Quality Management, and Purchasing to implement tailor-made solutions
- Ensuring quality standards, project goals, and stable manufacturing processes
- Execution and evaluation of analyses as well as preparation of reports on new manufacturing processes, e.g., EMPB
Your Profile
- Completed degree in Microsystems Technology, Semiconductor Technology, Mechanical Engineering, Process Engineering, or comparable
- Industrial experience in the development of packaging processes, e.g., substrate, panel, or wafer singulation, molding, as well as assembly processes like wire bond, die bond, or flip chip
- Knowledge of common assembly and connection technologies, including soldering, Chip on Board, dicing, wafer processing, and molding
- Sound understanding of mechanical processes on wafers, substrates, and metallizations, as well as their influence on product quality, development time, and costs
- Experience with process-oriented challenges in series production, particularly yield, stability, and reproducibility
- Very good knowledge of statistical and mathematical methods, data-based process analysis, as well as specification and acceptance of equipment
- Fluent German and good English language skills
What we offer you
- Thorough onboarding into a motivated team with a pleasant working atmosphere & open communication culture
- Ideal walking distance via public transport (BVG), S7 Raoul-Wallenberg-Str. / S75 Gehrenseestr. / Bus 154, as well as parking directly on the company premises
- Flexible working hours and annual working time account
- Family-friendly corporate culture
- Personal and professional development and further training opportunities
- We don't even count the excellent coffee, foosball, table tennis, or the grill on the roof terrace, because we are about substance: the exciting environment at an innovative medium-sized company with high technical diversity
Find more English Speaking Jobs in Germany on Arbeitnow
Required skills
- english
- german
- mechanical engineering
- project management
- molding
- process engineering
- quality management
- data analysis
- r&d
- statistical methods
- iot
- manufacturing processes
- industrial engineering
- soldering
- series production
- security solutions
- yield
- process analysis
- stability
- equipment specification
- process equipment
- reproducibility
- mechanical processes
- semiconductor technology
- chip on board
- panel processing
- storage solutions
- mathematical methods
- semiconductor packaging
- packaging processes
- process development engineer
- advanced packaging
- microsystems technology
- flip chip
- wafer processing
- substrate processing
- die bond
- wire bond
- dicing
- metallizations
Interested in this position?
Create your free account and tailor your CV to match this job.