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Principal Thermal Solutions Engineer - Paris/Grenoble
Job description
About Vinci
We are building Physics AI for hardware design. Our software platform helps hardware designers and physics simulation engineers explore, analyze, and optimize hardware systems, leveraging cutting-edge AI to deliver ultrafast, accurate physics intelligence within the realities of engineering design workflows.
Our first product bridges the gap between the accuracy & determinism of traditional simulation and the speed & scaling of AI, and is redefining how the world’s most advanced semiconductors are designed, verified, built, brought to market and integrated in complex systems.
Role Overview
As a pivotal leader within our European Forward Deployment team, you will drive the adoption of Vinci’s platform among the region's top engineering organizations. In this strategic role, you will build, mentor, and guide a high-performing team of thermal engineers dedicated to engaging prospective customers and demonstrating the transformative value of our software.
By acting as trusted technical advisors, you and your team will utilize deep simulation expertise to help enterprise customers validate and optimize complex, real-world designs. Through these collaborative engagements, you will champion Vinci's value proposition—showcasing how our platform delivers systemic improvements in thermal performance, product reliability, and accelerated time-to-market.
Leveraging strong fundamentals in thermal physics and cooling strategies, you will guide analyses of complex thermal management systems, fluid flow dynamics, and heat dissipation challenges. This includes both steady-state and transient thermal behavior. Your team will help customers evaluate critical factors such as thermal risk, component reliability, power density, and cooling efficiency to architect cutting-edge thermal management systems for next-generation hardware.
You will work closely with customer engineering teams to understand their technical challenges, provide expert guidance, and clearly articulate Vinci’s capabilities in solving real-world problems. Additionally, you will serve as a key feedback channel to product and engineering teams, translating customer insights into actionable inputs that shape product direction and drive continuous improvement.
This is a remote role, with close collaboration with Sales, Product, and Engineering in Palo Alto, CA, USA. The role includes moderate travel, primarily within continental Europe. Some infrequent intercontinental travel may be required for discussions and collaboration with the US team.
Responsibilities
Build, lead, and scale a high-performing team of thermal engineers, setting the technical direction, hiring, mentoring team members, and driving field execution across Europe.
Collaborate closely with the sales team to lead technical discussions, scope proof-of-concept (PoC) evaluations, and deliver compelling product demonstrations to prospective enterprise customers.
Guide customer engineering teams through the evaluation phase by overseeing simulation setup, running complex test cases, and interpreting results to explicitly prove Vinci’s technical and business value.
Own customer enablement through onboarding, deployment pipeline and account expansion, providing senior technical guidance, structured training sessions, and advanced troubleshooting.
Provide product guidance and feedback, identify customer pain points and workflow bottlenecks, partnering directly with internal product and engineering teams to transform field feedback into critical new product features.
Represent Vinci at major industry conferences and semiconductor events, engaging technically with key prospects and partners through technical presentations and live platform demonstrations.
Maintain a strong understanding of competitive technologies, industry trends, and market positioning to communicate Vinci’s differentiators effectively.
Qualifications (Minimum Qualifications)
Education: Degree in Mechanical Engineering, Electrical Engineering, or a closely related technical field.
Technical depth: Expert-level mastery of commercial simulation software (Flotherm, Ansys Icepak/Fluent, Simcenter STAR-CCM+, or equivalent), with 15+ years of hands-on experience in thermal management and cooling solutions — either as a practitioner running simulations, or as a technical account manager for commercial physics simulation software.
Industry Domain: Deep familiarity with semiconductor electronics packaging, advanced packaging technologies (e.g., 2.5D/3D IC), or foundry ecosystems.
Customer Engagement: Prior experience in dedicated customer-facing roles, with a strong ability to build trust and manage engineering client relationships.
Automation & Scripting: Practical programming experience using Python or C++ to automate workflows or parse simulation data.
Leadership Impact: Proven track record of prior managerial or technical leadership experience, with the ability to scale, mentor, and drive execution across engineering teams.
Communication: Elite interpersonal and communication skills, with a proven ability to distill complex physics and simulation results into clear, high-impact narratives for both deep technical panels and business-oriented executives.
Preferred (Desirable Differentiators)
Multiphysics Breadth: Familiarity with structural mechanical simulations (FEA/stress) and/or Electrical Signal Integrity and Power Integrity (SI/PI) workflows.
Commercial Track Record: Direct experience commercializing technical software—ideally electronic design automation (EDA) or CAE simulation tools—into major semiconductor and electronics enterprises.
Go-To-Market Experience: Prior experience explicitly within technical pre-sales, application engineering (FAE), or strategic technical sales environments.
Emerging Tech Adjacency: Ability to rapidly adopt and champion next-generation, physics-based workflows and AI-assisted design or simulation tools.
Why Join Us
Not just use AI, Be part of a team that is actively redefining how the next-generation silicon and hardware are architected.
Work at the absolute convergence of state of the art AI models, fundamental physics, and high-stakes enterprise
Collaborate with world-class engineers and researchers in a fast-moving startup environment.
About Vinci
We are developing Physics AI for hardware design. Our software platform helps hardware designers and physics simulation engineers explore, analyze, and optimize complex systems, leveraging cutting-edge AI to deliver ultrafast, accurate physics intelligence, integrated into the realities of engineering design processes.
Our first product bridges the gap between the accuracy and determinism of traditional simulations and the speed and scalability of AI. It redefines how the world's most advanced semiconductors are designed, verified, manufactured, brought to market, and integrated into complex systems.
Role Overview
As a key member of our European Forward Deployment team, you will play a decisive role in the adoption of the Vinci platform among the region's leading engineering organizations. In this strategic role, you will build, mentor, and lead a high-performing team of thermal engineers, dedicated to supporting potential clients and demonstrating the transformative value of our software.
As a trusted technical advisor, you and your team will leverage your deep simulation expertise to help industrial clients validate and optimize complex designs under real-world conditions. Through these collaborations, you will champion Vinci's value proposition by demonstrating how our platform enables systemic improvements in thermal performance, product reliability, and time-to-market.
With strong fundamentals in thermal physics and cooling strategies, you will guide the analysis of complex thermal management systems, fluid flow dynamics, and heat dissipation challenges. This includes both steady-state and transient thermal behaviors. Your team will help clients evaluate critical factors such as thermal risks, component reliability, power density, and cooling efficiency to design cutting-edge thermal management systems for next-generation hardware.
You will work closely with client engineering teams to understand their technical challenges, provide in-depth expertise, and clearly explain Vinci's capabilities in solving real-world problems. You will also serve as a crucial link between clients and our Product and Engineering teams, transforming field feedback into actionable insights to guide the product roadmap and fuel continuous improvement.
This is a position based in France, with remote work, and close collaboration with Sales, Product, and Engineering teams based in Palo Alto, California, USA. The role involves moderate travel, primarily within continental Europe. Occasional travel to the United States may also be necessary for discussions and collaboration with the US team.
Responsibilities
Build, lead, and develop a high-performing team of thermal engineers, defining the technical direction, recruiting and mentoring team members, and driving field execution across Europe.
Collaborate closely with the Sales team to lead technical discussions, define the scope of proof-of-concept (PoC) evaluations, and deliver compelling product demonstrations to potential industrial clients.
Support client engineering teams during the evaluation phase by overseeing simulation setup, executing complex test cases, and interpreting results to concretely demonstrate Vinci's technical and business value.
Drive customer technical support, including onboarding, deployment, and account expansion, by providing high-level technical expertise, structured training sessions, and advanced troubleshooting support.
Provide product guidance and feedback, identify client pain points and workflow bottlenecks, and collaborate directly with internal Product and Engineering teams to transform field feedback into key product features.
Represent Vinci at major industry conferences and semiconductor events, engaging with strategic prospects and partners through technical presentations and live platform demonstrations.
Maintain an excellent understanding of competing technologies, industry trends, and market positioning to effectively communicate Vinci's differentiating factors.
Qualifications (Minimum Qualifications)
Education: Degree in Mechanical Engineering, Electrical Engineering, or a closely related technical field.
Technical Expertise: Expert mastery of commercial simulation software (Flotherm, Ansys Icepak/Fluent, Simcenter STAR-CCM+, or equivalent), with over 15 years of hands-on experience in thermal management and cooling solutions — either as a practitioner performing simulations, or as a Technical Account Manager for commercial physics simulation software.
Industry Domain: Solid knowledge of semiconductor electronics packaging technologies, advanced packaging technologies (e.g., 2.5D/3D IC), or foundry ecosystems.
Client Relations: Prior experience in directly customer-facing roles, with a strong ability to build trust and manage relationships with engineering clients.
Automation & Scripting: Practical programming experience with Python or C++ to automate workflows or analyze simulation data.
Leadership: Proven experience in management or technical leadership, with the ability to develop a team, mentor its members, and drive execution within engineering teams.
Communication: Excellent interpersonal and communication skills, with a demonstrated ability to translate complex physics and simulation results into clear, high-impact messages for both high-level technical stakeholders and business-oriented executives.
Preferred (Differentiating Assets)
Multiphysics Expertise: Knowledge of structural mechanical simulations (FEA/stress) and/or Signal Integrity and Power Integrity (SI/PI) workflows.
Commercial Experience: Direct experience in commercializing technical software — ideally Electronic Design Automation (EDA) or CAE simulation tools — for major semiconductor and electronics companies.
Go-to-Market Experience: Prior experience in technical pre-sales, application engineering (FAE), or strategic technical sales environments.
Emerging Technologies: Ability to rapidly adopt and champion next-generation physics-based workflows and AI-assisted design or simulation tools.
Why Join Us?
Don't just use AI: join a team that is actively redefining how next-generation silicon and hardware systems are architected.
Work at the convergence of cutting-edge AI models, fundamental physics, and high-stakes industrial projects.
Collaborate with world-class engineers and researchers in a dynamic and evolving startup environment.
Compensation: €120K – €130K
- • €120K – €130K
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Company information
- Company
- Vinci4D
- Location
-
Paris / Gernoble
Germany - Posted
- 4 days ago
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