PCB Design Senior Engineer

The Role:

We are looking for a Senior PCB Design Engineer with strong EDA library ownership and advanced high-speed board design experience to drive the implementation of our next-generation data center accelerator platforms.

In this role, you will be responsible for the complete PCB design process, from library definition and design rules, through floorplanning, routing, and tape-out, while collaborating closely with Signal Integrity (SI) and Power Integrity (PI) experts to define layer stacks, PDN strategies, and constraints.

This is a hands-on, technically demanding role focused on very high-density, high-layer-count boards, pushing the limits of power delivery, memory integration, and high-speed interfaces, using Siemens Xpedition as the primary design environment.

Key Responsibilities:

· Design and layout complex, high-layer-count PCBs for accelerator and data center platforms

· Own and maintain EDA libraries (symbols, footprints, padstacks, constraints)

· Define routing constraints and complex design rules for high-speed and high-power designs

· Collaborate with SI/PI teams on layer stack-ups, impedance control, and PDN design

· Collaborate with mechanical and thermal experts to ensure design integration

· Drive designs from concept through tape-out, including manufacturing deliverables

· Support DFM reviews, board bring-up, and hardware debug activities

Required Qualifications:

· Bachelor’s and Master’s degree in Electrical Engineering or related field.

· 5+ years of hands-on PCB layout experience in complex hardware programs.

· Strong experience with Siemens Xpedition (layout and library tools strongly preferred).

· Proven background designing high-speed, high-layer-count boards.

· Solid understanding of:

-Signal Integrity and Power Integrity fundamentals

-Controlled impedance routing

-High-density interconnects and advanced packages

· Experience creating and maintaining EDA component libraries.

· Ability to work effectively with cross-functional teams (SI, PI, schematic, ME, manufacturing).

Preferred Qualifications:

· Experience with data-center, accelerator, networking, or HPC hardware.

· Direct involvement in memory subsystem integration and high-speed serial interfaces.

· Familiarity with SI/PI simulation workflows and constraint-driven design.

· Experience defining layer stacks in collaboration with fabricators and SI/PI teams.

· Knowledge of DFM/DFT/DFX principles for high-volume and advanced PCB manufacturing.

· Comfortable working in fast-moving, technically ambitious engineering environments.

What do we offer?

· Join an innovative team and experience company growth.

· We believe in investing in our employees and providing them with the opportunities they need to grow and develop their careers.

· Enjoy a hybrid work environment.

· We also offer flexible schedule.

· We offer a remuneration that values your experience.

· The position will have preferably the base in Karlsruhe (Germany).

We are looking for outstanding people willing to join our mission to change this industry and help to build a better world.

If you feel identified with Openchip, please contact us. We can offer a competitive compensation package in a flexible work schema that will help you to keep a balance between your personal and professional life.

At Openchip & Software Technologies S.L., we believe a diverse and inclusive team is the key to groundbreaking ideas. We foster a work environment where everyone feels valued, respected, and empowered to reach their full potential – regardless of race, gender, ethnicity, sexual orientation, or gender identity.

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