Sign up to save this job, get alerts, and apply with an optimized CV.
Package Design Engineer
Job description
Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing innovative packaging solutions for next-generation devices. Key responsibilities include: • Designing and optimizing package structures, materials, and processes to meet performance, cost, and reliability requirements. • Collaborating with cross-functional teams to integrate packages with ASICs, PCBs, and other components. • Developing and maintaining expertise in package design tools, such as Cadence Virtuoso, Mentor Graphics Expedition, or ANSYS HFSS. • Staying up-to-date with industry trends, advancements, and best practices in packaging technology. • Participating in continuous improvement initiatives to enhance process efficiency, reduce costs, and improve product quality. • Working closely with manufacturing teams to ensure seamless transition from design to production. • Providing technical support and guidance to internal stakeholders and external partners. • Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field. • 5+ years of experience in package design engineering, preferably with expertise in flip-chip-BGA packages, ASICs, and high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC). • Strong understanding of packaging materials, processes, and reliability considerations. • Excellent problem-solving skills, analytical thinking, and attention to detail. • Effective communication and collaboration skills, with the ability to work in a fast-paced environment. • Ability to work independently and as part of a team. • Strong technical skills, including proficiency in CAD software, simulation tools, and programming languages (e.g., Python, C++, MATLAB). • Familiarity with industry-standard design rules, manufacturing processes, and quality control procedures. • Certification in package design or related field is a plus.
Required skills
Sign up to apply
Create a free account to apply for this job and get access to:
- AI-powered CV optimization for this specific job
- Save jobs and create custom alerts
- See your CV match score for each job
Company information
- Company
- Broadcom
- Location
-
Singapore, North, Yishun
Singapore - Posted
- 2 months ago
Interested in this position?
Create your free account and tailor your CV to match this job.