Jabil
2 months ago
Failure Analysis Engineer
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Company information
- Company
- Jabil
- Location
- India India
- Posted
- 2 months ago
Job description
Failure Analysis (FA) Engineer - PCBA
Role Overview:
The Failure Analysis Engineer is responsible for performing root-cause analysis on defective or failed printed circuit board assemblies (PCBAs). By using destructive and non-destructive testing techniques—specifically Dye & Pry and Cross-Section Analysis—the engineer identifies physical defects and translates findings into actionable improvements in manufacturing and design.
Key Responsibilities:
- Failure Analysis Execution: Perform Dye & Pry testing on suspect SMT and BGA components to verify solder joint integrity, detect fatigue cracks, pad cratering, and open circuits.
- Cross-Sectioning: Prepare, mount, grind, and polish PCBA samples to analyze internal layer structures, plated through-holes (PTH), intermetallic compounds (IMC), and layer thicknesses.
- Microscopy & Imaging: Utilize optical microscopes and Scanning Electron Microscopes (SEM) to inspect, document, and measure defects found during testing.
- Data Interpretation: Analyze defect data, evaluate findings against industry standards (such as IPC-TM-650 testing protocols), and document detailed FA reports.
- Process Improvement: Collaborate with manufacturing, quality, and process engineering teams to recommend corrective actions and prevent recurring soldering or assembly defects.
Qualifications & Skills:
- Education: Bachelor's or Master's degree in Materials Science, Electronics, Mechanical Engineering, or a related field.
- Experience: Hands-on experience in PCBA lab environments, specifically handling sample preparation, mounting (puck preparation), and optical/chemical microsectioning.
- Industry Standards: Strong working knowledge of IPC workmanship and acceptance criteria (e.g., IPC-A-610, IPC-TM-650).
- Analytical Tools: Experience using optical and metallurgical microscopes; familiarity with X-ray, SEM, and EDS is a strong plus.
Required skills
- mechanical engineering
- process improvement
- sem
- non-destructive testing
- data interpretation
- failure analysis
- fa
- x-ray
- sample preparation
- mounting
- materials science
- pcba
- electronics engineering
- root-cause analysis
- imc
- ipc-a-610
- pth
- eds
- destructive testing
- dye & pry
- cross-section analysis
- smt components
- bga components
- solder joint integrity
- fatigue cracks
- pad cratering
- open circuits
- microsectioning
- plated through-holes
- intermetallic compounds
- optical microscopes
- scanning electron microscopes
- ipc-tm-650
- puck preparation
- optical microsectioning
- chemical microsectioning
- metallurgical microscopes
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