Failure Analysis Engineer | Base location in India and who can travel/work in Taiwan.

Failure Analysis Engineer | Base location in India and who can travel/work in Taiwan.

Job Description:

• Perform the full range of activities in Failure Analysis for customer-returned failure ICs;
• Discuss and fully comprehend the customer failure mode, type and rate from CQE/FAE using the CRA form, and ensure customer failure mode has been verified on the bench by the FAE;
• Carry out non-destructive analysis such as external package inspection using optical microscopy, continuity checks using digital multimeters or IV curve tracing, X-ray inspection, CSAM, and others where necessary;
• Rework failure units through cleaning and re-balling for WLCSPs;
• Perform electrical retest of the failure units on the ATE;
• Work with Engineering to understand the parametric or functional failure items from the ATE retest;
• Carry out further non-destructive verification of the failure mode if necessary, including bench test using EVBs;
• Prepare and submit interim 4D/FAR and 8D/CAR to Sales/FAE as an update of the progress for the FA;
• Develop the Destructive FA plan that includes Decapsulation, Delayering, High-power OM and SEM, FIB, Cross-sectioning and other analysis techniques by coordinating such work with 3rd party labs.
• Generate, communicate and submit final 4D/FAR and 8D/CAR to Sales/FAE in a timely manner;
• Work closely with SQE on assembly-related quality issues and PE/DE on design-related failures;
• Manage customer complaints by working closely with CQE/SQE and subcontractors on the required action items;
• Submit and present FA updates during weekly TQM review meeting;
• Perform any other tasks that are assigned by the Supervisor as and when required; and
• Be an active TQM member by contributing knowledge and value to the team.

Position Requirements:

• 1-5 years of work experience in analog/power IC companies
• Knowledge of Failure Analysis and FA techniques, including EFA, NDA, DFA and Fault Isolation
• Good Understanding of semiconductor device physics and IC packaging technologies will be favorable
• Basic knowledge of Foundry and OSAT processes, especially WLCSP and FC packaging, is highly desirable
• Good communication, interpersonal and team skills

Interested? Send your updated profile to [email protected]

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