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Engineering Execution Manager, High Bandwidth Memory (HBM)
900.00 - 1200.00
Job description
Responsibilities Integrate all aspects of HBM development within the extended HIG and TPG teams and with partner organizations. Partner with the Technology Development, Design, Process, APTD, PE and Manufacturing teams to drive development progress and alignment. Collaborate with PMO org to build and maintain detailed development schedule and drive relevant tactical execution starting from pre-silicon to all the way to HVM. Provide regular communication of development status, priorities, and changes to stakeholders. Ensure effective integration of HBM development with other projects and initiatives within the organization. Develop and maintain relationships with key stakeholders, including partner organizations, to ensure successful collaboration and alignment. Identify and mitigate potential risks and issues that may impact HBM development progress. Analyze and report on project metrics and KPIs to measure progress and identify areas for improvement. Provide input to the development of project plans, schedules, and budgets. Ensure compliance with organizational policies, procedures, and standards. Develop and maintain documentation of HBM development processes, procedures, and best practices. Collaborate with other teams to develop and implement process improvements. Drive continuous learning and professional development within the team.
Required skills
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Company information
- Company
- 1100 Micron SemiAsiaOP Pte Ltd
- Location
-
Singapore
Singapore - Posted
- 2 months ago
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